1. product profile 1.1 general description planar maximum efficiency general application (mega) schottky barrie r rectifiers with an integrated guard ring for stress protection encapsulated in small smd plastic packages. 1.2 features ? forward current: 3 a ? reverse voltage: 10 v ? ultra low forward voltage ? small and flat lead smd package 1.3 applications ? low voltage rectification ? high efficiency dc-to-dc conversion ? switched-mode power supply ? inverse polarity protection ? low power consumption applications 1.4 quick reference data [1] pulse test: t p 300 s; ? 0.02. PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers rev. 04 ? 15 january 2010 product data sheet table 1. product overview type number package configuration nxp jeita PMEG1030EH sod123f - single isolated diodes pmeg1030ej sod323f sc-90 single isolated diodes table 2. quick reference data symbol parameter conditions min typ max unit i f forward current t sp 55 c --3a v r reverse voltage - - 10 v v f forward voltage i f =3a [1] - 390 530 mv
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 2 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking table 3. pinning pin description simplified outline symbol 1 cathode [1] 2 anode 001aab540 12 sym00 1 12 table 4. ordering information type number package name description version PMEG1030EH - plastic surface mounted package; 2 leads sod123f pmeg1030ej sc-90 plastic surface mounted package; 2 leads sod323f table 5. marking codes type number marking code PMEG1030EH ac pmeg1030ej e7
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 3 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] for schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. nomograms for determining the reverse power losses p r and i f(av) rating will be av ailable on request. [3] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 10 v i f forward current t sp 55 c-3a i frm repetitive peak forward current t p 1 ms; ? 0.25 - 5.5 a i fsm non-repetitive peak forward current t = 8 ms; square wave [1] -9a p tot total power dissipation t amb 25 c PMEG1030EH [1] - 375 mw [2] - 830 mw pmeg1030ej [1] - 360 mw [2] - 830 mw t j junction temperature - 150 c t amb ambient temperature ? 65 +150 c t stg storage temperature ? 65 +150 c table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air PMEG1030EH [1] [2] --330k/w [2] [3] --150k/w pmeg1030ej [1] [2] --350k/w [2] [3] --150k/w r th(j-sp) thermal resistance from junction to solder point PMEG1030EH - - 60 k/w pmeg1030ej - - 55 k/w
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 4 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 7. characteristics [1] pulse test: t p 300 s; ? 0.02. table 8. characteristics t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage [1] i f = 0.01 a - 100 130 mv i f = 0.1 a - 170 200 mv i f = 1 a - 280 350 mv i f = 3 a - 390 530 mv i r reverse current v r = 5 v - 0.55 2 ma v r =8v - 0.8 2.5 ma v r =10v - 1 3 ma c d diode capacitance v r =1v; f=1mhz - 70 85 pf (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = ? 40 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = ? 40 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values 006aaa290 10 1 10 3 10 2 10 4 i f (ma ) 10 ? 1 v f (v) 0 0.4 0.5 0.3 0.1 0.2 (1) (3) (4) (2) 006aaa291 10 3 10 10 2 10 5 10 4 10 6 i r ( a) 1 v r (v) 010 8 46 2 (1) (2) (3) (4)
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 5 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 13 . t amb =25 c; f = 1 mhz fig 3. diode capacitance as a function of reverse voltage; typical values v r (v) 010 8 46 2 006aaa292 70 90 50 110 130 c d (pf) 30 fig 4. package outline sod123f fig 5. package outline sod323f (sc-90) 04-11-29 dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 table 9. packing methods the -xxx numbers are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 PMEG1030EH sod123f 4 mm pitch, 8 mm tape and reel -115 -135 pmeg1030ej sod323f 4 mm pitch, 8 mm tape and reel -115 -135
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 6 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 10. soldering reflow soldering is the only recommended soldering method. dimensions in mm fig 6. reflow soldering footprint sod123f reflow soldering is the only recommended soldering method. dimensions in mm fig 7. reflow soldering footprint sod323f (sc-90) 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ) solder lands solder resist occupied area solder paste msa433 1.65 0.50 (2 ) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 7 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 11. revision history table 10. revision history document id release date data sheet status change notice supersedes PMEG1030EH_ej_4 20100115 product data sheet - PMEG1030EH_ej_3 modifications: ? this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content. PMEG1030EH_ej_3 20050602 product data sheet - PMEG1030EH_ej_2 PMEG1030EH_ej_2 20050405 product data sheet - pmeg1030ej_1 pmeg1030ej_1 20050124 product data sheet - -
PMEG1030EH_ej_4 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 15 january 2010 8 of 9 nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
nxp semiconductors PMEG1030EH; pmeg1030ej 10 v, 3 a ultra low v f mega schottky barrier rectifiers ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 january 2010 document identifier: PMEG1030EH_ej_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 packing information . . . . . . . . . . . . . . . . . . . . . 5 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 contact information. . . . . . . . . . . . . . . . . . . . . . 8 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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